This book describes in detail the reported synthesis methods of inorganic perovskite semiconductors, including nanocrystal, films, and single crystals. Then, the promising properties of inorganic perovskite semiconductors, such as high luminescent efficiencies, strong absorption, and excellent stability, are discussed and summarized. Owing to the attracted performance of inorganic perovskite semiconductors above, their potential applications in solid-state lighting and visible light communication, laser devices, solar cells, detectors, as well as electronic devices, are reviewed in this book. Apart from the conventional inorganic lead halide perovskites, lead-free metal halide perovskites are described and discussed. Finally, it also covers the recent challenges and perspectives of the inorganic perovskite semiconductors. This book is intended for undergraduate and graduate students who are interested in inorganic perovskites, researchers investigating novel inorganic perovskite, and engineers who working on the optimization of inorganic-perovskite-based devices.

Photomechanics describes the use of photonics techniques for the nondestructive measurement of variations in certain important physical quantities such as displacements, strains, densities, etc. in experimental solid mechanics and flow. Offering authoritative reviews by internationally recognized experts, the book provides a wealth of information on the essential principles and methods today available in this realm. These include holographic and moiré interferometry, speckle metrology, two- and three-dimensional computer-vision methods as well as laser-Doppler and pulsed-laser velocimetries. The instructive nature of the book makes it an excellent text for physicists and practicing engineers who want to use photomechanics for solving their specific measurement problems and for researchers in various disciplines requiring a broad introduction to the subject.

As we approach the end of the present century, the elementary particles of light (photons) are seen to be competing increasingly with the elementary particles of charge (electrons/holes) in the task of transmitting and processing the insatiable amounts of infonnation needed by society. The massive enhancements in electronic signal processing that have taken place since the discovery of the transistor, elegantly demonstrate how we have learned to make use of the strong interactions that exist between assemblages of electrons and holes, disposed in suitably designed geometries, and replicated on an increasingly fine scale. On the other hand, photons interact extremely weakly amongst themselves and all-photonic active circuit elements, where photons control photons, are presently very difficult to realise, particularly in small volumes. Fortunately rapid developments in the design and understanding of semiconductor injection lasers coupled with newly recognized quantum phenomena, that arise when device dimensions become comparable with electronic wavelengths, have clearly demonstrated how efficient and fast the interaction between electrons and photons can be. This latter situation has therefore provided a strong incentive to devise and study monolithic integrated circuits which involve both electrons and photons in their operation. As chapter I notes, it is barely fifteen years ago since the first demonstration of simple optoelectronic integrated circuits were realised using m-V compound semiconductors; these combined either a laser/driver or photodetector/preamplifier combination.

Controlling the mechanical, electrical, magnetic, and optical properties of materials by advanced fabrication methods (Le. ; Molecular Beam Epitaxy and Metal-Organic Chemical Vapor Deposition) has become the new paradigm in our research era. Sensors, being the most vital part of the electronic data processing and decision making machines, stand to gain the most from engineering of the properties of materials. Microfabrication technology has already contributed significantly to the batch fabrication of micro-sensors with higher over all qualities compared to their counterparts that are fabricated using other methods. Batch fabrication of micro-sensors i) results in more uniform properties of co-fabricated devices, ii) nearly eliminates the need for characterization of individual sensors, and iii) eliminates a need for laborious alignment procedures. A less obvious benefit of using microfabrication methods is the possibility of precise control over the dimensions of the sensor. This control enables engineering of some of the properties of the material which affect the sensor's operation. There are many examples of this in the literature. Optical sensors are known to have superior properties over their counterparts that use other (i. e. ; electrostatic and magnetic) means of detection. To name a few, these advantages are: i) immunity to electromagnetic interferences, ii) higher sensitivities compared to the other types of sensors, iii) simplicity of operation principles, and iv) simplicity of overall construction.

Provides a comprehensive look at the application of photonic approaches to the problem of analog-to-digital conversion. It looks into the progress made to date, discusses present research, and presents a glimpse of potential future technologies.

This book covers a broad range of interdisciplinary topics, focusing on atoms and molecules in intense laser fields, excitation processes in intense laser fields, photonics and materials, high-order harmonics generation, XFEL, high-power lasers and their applications, and quantum computing. This seventeenth volume features contributions from world-renowned researchers on topics such as applications of attosecond and femtosecond laser pulses, coherence and dynamics in quantum systems, and applications of super-intense laser fields.

This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics.